IoT Production Process

From your Idea to a certified, market-ready device

We design, build and ship custom IoT hardware and firmware, entirely in-house, in Mendrisio.
One team, one timeline, no gaps between steps.

4-6

2K

0+

weeks from approved design to first delivery

devices/month in-house production

minimum batch, no high-volume lock-in

Our Process

How every project unfolds

Four phases, one team. Each step feeds directly into the next: no handoffs, no waiting on external suppliers.
Whether you need a small batch for testing or a large-scale production run, our production line adapts to meet all requirements

Opportunity analysis & real needs assessment

We start with a structured conversation, not a sales call. We map your technical constraints, your timeline, and what success actually looks like for your business. This phase exists to prevent misaligned development. You walk away with a clear solution brief, not a vague proposal.

WHAT WE DEFINE

Technical constraints · budget envelope · connectivity requirements (LoRaWAN, NB-IoT, BLE) · certification targets · production volume.

DELIVERABLE

Solution brief with proposed architecture, timeline estimate, and cost framework shared before any work begins.

Draft design: schematic, firmware, enclosure

Based on the agreed brief, our engineers produce PCB schematics, firmware architecture, and a 3D-printed enclosure prototype. You review and approve at each checkpoint before production begins.

HARDWARE

PCB schematic and layout · component sourcing · CNC or 3D-printed enclosure prototype · design-for-manufacturability review

FIRMWARE

Protocol stack selection · power management architecture · OTA update strategy · initial integration tests

Build & Test: assembly, firmware, certification prep

Our SMT line assembles the PCBs. Embedded firmware is flashed and tested. Every batch goes through climate-chamber stress tests and pre-certification verification before leaving the building.

Every device passes our in-house diagnostic suite, checking communication reliability, sensor accuracy, power efficiency, and firmware stability. In additionHemarGroup’s production site and all processes are ISO and IPC certified.

PRODUCTION

SMD pick-and-place assembly · CNC Milling & Laser Cutting · reflow soldering · automated optical inspection · firmware flash and QA · 3D & UV Printing.

TESTING

Binder MKF 56 E4 climate chamber · RF performance · power consumption validation.

Ship & support: delivery, platform, long-term care

Certified devices ship on schedule. The same team that built the hardware maintains your firmware and cloud platform. We track field performance and proactively flag issues, before your users do.

DELIVERY

CE-marked packaging · batch documentation · logistics coordination · customs guidance for international shipments

ONGOING SUPPORT

Firmware updates via OTA · GIoT platform monitoring · hardware revision support · direct line to the engineers who built it

IN-HOUSE CAPABILITIES

Everything under one roof

Rapid, Flexible Custom Production for Scalable Solutions. By managing all aspects of production in-house, we cut lead times and remain agile when changes occur. On average, we deliver in 4–6 weeks from approved design
Every device, every tool, every test-bench is unger the same roof. 

PCB Design

Custom board layout and schematic, design-for-manufacturability review, and rapid fabrication iterations to minimize re-spins.

safe_flash_line

Embedded firmware

LoRaWAN, NB-IoT, and BLE, optimized for power management, field reliability, and OTA updates over the device lifetime.

3D Print & CNC

Enclosures, mechanical parts, and custom tooling. Same-day prototyping lets us iterate on form factor without waiting weeks for external fabrication.

SMD assembly

Pick-and-place line for high-density PCBs, from 1-unit pilot runs to 2,000 devices/month, with automated optical inspection at every run.

Climate Testing

Binder MKF 56 E4 climate chambers for thermal cycling and humidity stress, every batch is tested before it leaves the production floor

Cloud Platform Integration

Device management, data collection, and real-time analytics integrated into your existing platform or into our GIoT cloud system.

CERTIFICATION & COMPLIANCE

Ready for regulated markets

We provide complete guidance through CE and ISO certification processes with the support of our trusted international certification partners.

BEFORE YOU REACH OUT

Frequently Asked Questions

Yes, Gimasi support customers from concept and prototyping through certification, manufactoring, deployment and long-term product support. 

We provide a full cycle development process: PCB design, electronics engineering, embedded firmware development, cloud software, mobile applications, connectivity integration, industrialization, and manufacturing support.

Yes. We support certification processes, regulatory compliance, cybersecurity requirements, testing activities, and market access requirements. ISO/IEC 27001, CE.

Yes, our production process includes an in-house testing phase to verify the responsiveness and proper functioning of each device, and we support both prototype production and large-scale manufacturing through our internal capabilities and industrial production partners.

Some of the companies and organizations we are partners with are:

  • Swisscom
  • Coop Switzerland
  • Deutsche Telekom
  • Hemargroup

Additionally, we reference collaborations with:

  • universities and R&D institutions
  • startups and SMEs
  • industrial IoT players across Europe
  • LoRaWAN ecosystem partners and network operators

Have an idea? Let's make it real.

Tell us about your project. We’ll respond with professionality and transparency.